Influence of carbonized polymer dot (CPD) structure on mechanical and electrical properties of copper matrix composite

Abstract Outstanding comprehensive properties and promising application perspective make copper (Cu) matrix composite become a hotspot in the research. However, poor dispersion of the carbon nanomaterials in Cu matrix and weak interface bonding between the carbon and Cu metal are inevitable to be the biggest obstacle. Here, carbonized polymer dots (CPD), which has the structural characteristics of graphene and carbon nanotubes, as well as rich surface functional groups and water solvent dispersion, have been successfully synthesized via hydrothermal and employed as a nano‑carbon reinforcement in pure Cu matrix. Microstructure analysis demonstrates that CPD are well dispersed in the Cu matrix in the form of nanoclusters with a size of about 20 nm, and the interface between CPD and Cu is well bonded. The CPD prepared from EDA: CA (ethylenediamine: citric acid) 1:1 show ~20.0% higher in ultra-tensile strength than that of pure Cu and obtain ~97.2% IACS in electrical conductivity. Herein, our research will provide an effective way to solve the bottleneck problem of copper-based composite materials.