A 10 /spl mu/m thick RF-ID tag for chip-in-paper applications

In CIRCONFLEX technology, circuits fabricated on SOI wafers are transferred to a 10 /spl mu/m thick polyimide carrier. The highly flexible circuits remain defect free even after bending to radii of less than 1 mm, making them attractive for chip-in-paper applications. The effect of bending on the transistors characteristics is very small as demonstrated in this paper. A fully autonomous RF-ID tag demonstrator circuit with integrated antenna, fabricated in CIRCONFLEX technology is presented. The 3/spl times/3 mm/sup 2/ tag operates up to 1.5 cm from the base station, and continues to function even while bent to a radius of 0.7 mm.