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M. Dumling
M. Dumling
NXP Semiconductors
Electronic circuit
Physics
Silicon on insulator
Wafer
Electronic engineering
3
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23
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Substrate Transfer: an Enabling Technology for System-in-Package Solutions
2006
BCTM | Bipolar/BiCMOS Circuits and Technology Meeting
Ronald Dekker
M. Dumling
J.-h. Fock
J.R. Haartsen
Henricus Godefridus Rafael Maas
Theodorus Martinus Michielsen
H. Pohlmann
W. Schnitt
Antoon Marie Henrie Tombeur
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Citations (5)
A 10 /spl mu/m thick RF-ID tag for chip-in-paper applications
2005
BCTM | Bipolar/BiCMOS Circuits and Technology Meeting
Ronald Dekker
M. Dumling
J.-h. Fock
O. Gourhant
C. Jonville
T.M. Michielsen
H. Pohlmann
W. Schnitt
Antoon Marie Henrie Tombeur
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Citations (12)
Circonflex: an ultra-thin and flexible technology for rf-id tags
2005
EMPC | European Microelectronics and Packaging Conference
Ronald Dekker
M. Dumling
Johann-heinrich Fock
O. Gourhant
C. Jonville
R. Kubrin
Theodorus Martinus Michielsen
H. Pohlmann
W. Schnitt
Amh Tombeur
Theodoros Zoumpoulidis
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Citations (6)
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