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H. Pohlmann
H. Pohlmann
NXP Semiconductors
Electronic circuit
Physics
Electronic engineering
Adhesive bonding
Silicon on insulator
3
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34
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Substrate Transfer: an Enabling Technology for System-in-Package Solutions
2006
BCTM | Bipolar/BiCMOS Circuits and Technology Meeting
Ronald Dekker
M. Dumling
J.-h. Fock
J.R. Haartsen
Henricus Godefridus Rafael Maas
Theodorus Martinus Michielsen
H. Pohlmann
W. Schnitt
Antoon Marie Henrie Tombeur
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Citations (5)
A 10 /spl mu/m thick RF-ID tag for chip-in-paper applications
2005
BCTM | Bipolar/BiCMOS Circuits and Technology Meeting
Ronald Dekker
M. Dumling
J.-h. Fock
O. Gourhant
C. Jonville
T.M. Michielsen
H. Pohlmann
W. Schnitt
Antoon Marie Henrie Tombeur
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Substrate transfer: enabling technology for RF applications
2003
IEDM | International Electron Devices Meeting
Ronald Dekker
K. Dessein
Johann-heinrich Fock
Andreas Gakis
C. Jonville
O.M. Kuijken
Theodorus Martinus Michielsen
P Mijlemans
H. Pohlmann
W. Schnitt
Cornelis Eustatius Timmering
Antoon Marie Henrie Tombeur
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Citations (17)
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