A semiconductor device a radiating structure, manufacturing process of a semiconductor device and method of fabricating an electronic instrument

Said device comprises two semiconductor chips (1a, 1b), interposed between a pair of radiating parts (2, 3) to which they are connected thermally and electrically. One (2) of the radiation parts has two protruding regions (2a), and front ends of said protruding regions (2a) are connected to main electrodes of the chips (1a, 1b). radiation of the workpieces (2, 3) are made of a metal material containing copper or aluminum as a main component. Said chips (1a, lb) and said parts (2, 3) are sealed with a resin (9), with the radiating surfaces (10) projecting outwardly.