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Rudy R. Giridharan
Rudy R. Giridharan
GlobalFoundries
Electronic engineering
Wafer
CMOS
Aspect ratio (aeronautics)
Silicon
4
Papers
18
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0
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2024
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Communication—Copper Grain Growth and Texture Formation in Copper-Titanium Thin Films
2017
ECS Journal of Solid State Science and Technology
Mohammad Faheem
Rudy R. Giridharan
Xintuo Dai
Alok Vaid
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Methodology to estimate TSV film thickness using a novel inline “adaptive pattern registration” method
2015
ASMC | Advanced Semiconductor Manufacturing Conference
Shravanthi L Manikonda
Dingyou Zhang
Rudy R. Giridharan
Abner Bello
Jun Song
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Process Development and Optimization for 3 $\mu \text{m}$ High Aspect Ratio Via-Middle Through-Silicon Vias at Wafer Level
2015
IEEE Transactions on Semiconductor Manufacturing
Dingyou Zhang
Daniel Smith
Gopal Kumarapuram
Rudy R. Giridharan
Shinichiro Kakita
Mohamed A. Rabie
Peijie Feng
Holly M. Edmundson
Luke England
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Successful void free gap fill of 3µm, high AR via middle, Through Silicon Vias at wafer level
2014
ASMC | Advanced Semiconductor Manufacturing Conference
Sarasvathi Thangaraju
Luke England
Mohamed A. Rabie
Dingyou Zhang
G. Kumarapuram
R. McGowan
A. Selsley
Rudy R. Giridharan
Sipeng Gu
Vijayalakshmi Seshachalam
C. Wang
Shinichiro Kakita
S. Baral
Wonwoo Kim
Holly M. Edmundson
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Citations (9)
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