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Yeong L. Park
Yeong L. Park
Samsung
Electronic engineering
Materials science
Silicon
Delamination
Extrusion
2
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34
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TSV optimization for BEOL interconnection in logic process
2012
DIC | IEEE International D Systems Integration Conference
Sin-Woo Kang
Sung-Dong Cho
Ki-Young Yun
Sangwook Ji
Kisoon Bae
Woon-Seob Lee
Eun-ji Kim
Jang-ho Kim
Jonghoon Cho
Hyongyol Mun
Yeong L. Park
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Citations (21)
Impact of TSV proximity on 45nm CMOS devices in wafer level
2011
IITC | International Interconnect Technology Conference
Sung-Dong Cho
Sin-Woo Kang
Kang-Wook Park
Jae-Chul Kim
Ki-Young Yun
Kisoon Bae
Woon-Seob Lee
Sangwook Ji
Eun-ji Kim
Jang-ho Kim
Yeong L. Park
Eun Seung Jung
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Citations (13)
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