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Timothy D. Sullivan
Timothy D. Sullivan
Infineon Technologies
Materials science
Copper
Aluminium
Mineralogy
Chemistry
4
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10
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Structures d'interconnexion à soudure résistant à l'extrusion et procédés de formation
2013
Timothy H. Daubenspeck
Jeffrey P. Gambino
Christopher D. Muzzy
Wolfgang Sauter
Timothy D. Sullivan
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Revêtement en tungstène pour structure d’interconnexion à base d’aluminium résistante à l’électromigration
2009
Jonathan D. Chapple‐Sokol
Daniel A. Delibac
He Zhong-Xiang
Tom C. Lee
William J. Murphy
Timothy D. Sullivan
David C. Thomas
Daniel S. Vanslette
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Reliability of Copper Interconnects: Stress-Induced Voids
2009
Jeff Gambino
Tom C. Lee
Fen Chen
Timothy D. Sullivan
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Electromigration study of Al and Cu metallization using WLR isothermal method
2002
IRPS | International Reliability Physics Symposium
Tom C. Lee
Michael W. Ruprecht
Deborah Tibel
Timothy D. Sullivan
Shengming Wen
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