author-photo

E.H. Wong

30

Papers

255

Citations

Citation Trend

Filter By

Papers (30) Sort By

Journal Conference Others

水分拡散モデリング批判的レビュー【Powered by NICT】

2016 Microelectronics Reliability
- E.H. Wong
- S.B.Park
Show All
- Source
- Cite
- Save
Citations (0)
Advances in creep-fatigue modelling of solder joints

2015
- E.H. Wong
- Y.W. Mai
Show All
- Source
- Cite
- Save
Citations (0)
Fatigue resistance of solder joints: Strain-life representation

2015
- E.H. Wong
- Y.W. Mai
Show All
- Source
- Cite
- Save
Citations (0)
Dynamic deformation of a printed circuit board in drop-shock

2015
- E.H. Wong
- Y.W. Mai
Show All
- Source
- Cite
- Save
Citations (0)
Rate-dependent stress–strain properties of solders

2015
- E.H. Wong
- Y.W. Mai
Show All
- Source
- Cite
- Save
Citations (2)
Fatigue crack growth in solder joints at high strain rate

2015
- E.H. Wong
- Y.W. Mai
Show All
- Source
- Cite
- Save
Citations (0)
Moisture properties and their characterisations

2015
- E.H. Wong
- Y.W. Mai
Show All
- Source
- Cite
- Save
Citations (0)
Stresses in solder joints due to the bending deformation of printed circuit boards in microelectronics assemblies

2015
- E.H. Wong
- Y.W. Mai
Show All
- Source
- Cite
- Save
Citations (1)
Advances in diffusion and vapour pressure modelling

2015
- E.H. Wong
- Y.W. Mai
Show All
- Source
- Cite
- Save
Citations (0)
Robust design of microelectronic assemblies against mismatched thermal expansion

2015
- E.H. Wong
- Y.W. Mai
Show All
- Source
- Cite
- Save
Citations (0)