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Ming-Lin Li
Ming-Lin Li
Industrial Technology Research Institute
Three-dimensional integrated circuit
Silicon
Electronic engineering
Guideline
Finite element method
2
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12
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Electrical testing of blind Through-Silicon Via (TSV) for 3D IC integration
2012
ECTC | Electronic Components and Technology Conference
Jui-Feng Hung
John H. Lau
Peng-Shu Chen
Shih-Hsien Wu
Shinn-Juh Lai
Ming-Lin Li
Shyh-Shyuan Sheu
Pei-Jer Tzeng
Zhe-Hui Lin
Tzu-Kun Ku
Wei-Chung Lo
Ming-Jer Kao
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Citations (10)
Electrical Performance of Through-Silicon Vias (TSVs) for High-Frequency 3D IC Integration Applications
2012
Jui-Feng Hung
John H. Lau
Peng-Shu Chen
Shih-Hsien Wu
Sheng-Che Hung
Shinn-Juh Lai
Ming-Lin Li
Shyh-Shyuan Sheu
Zhe-Hui Lin
Chih-Sheng Lin
Wei-Chung Lo
Ming-Jer Kao
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Citations (2)
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