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Vu Ngoc Tran Nguyen
Vu Ngoc Tran Nguyen
Applied Materials
Materials science
Dielectric
Copper interconnect
Annealing (metallurgy)
Porosity
3
Papers
5
Citations
0
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Structure et procédé pour interfaces sicoh présentant une résistance mécanique accrue
2008
Daniel C. Edelstein
Alexandros T. Demos
Stephen M. Gates
Alfred Grill
Steven E. Molis
Vu Ngoc Tran Nguyen
Steven Reiter
Darryl D. Restaino
Kang Sub Yim
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Development and optimization of porous pSiCOH interconnect dielectrics for 45 nm and beyond
2008
IITC | International Interconnect Technology Conference
Alfred Grill
Stephen M. Gates
Christos D. Dimitrakopoulos
Vishnubhai Vitthalbhai Patel
S. Cohen
Y. Ostrovski
E. Liniger
Eva E. Simonyi
Darryl D. Restaino
S. Sankaran
Steven Reiter
Alex Demos
Kang Sub Yim
Vu Ngoc Tran Nguyen
Juan Carlos Rocha
Dustin W. Ho
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Extending CVD Low-k Interlayer Dielectric Solutions to 45nm and Beyond
2007
naoyuki iwasaki
takasi simizu
atusi tahata
Yim Kang Sub
Kelvin Chan
Vu Ngoc Tran Nguyen
Alex Demos
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