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Kang Sub Yim
Kang Sub Yim
Applied Materials
Materials science
Dielectric
Electronic engineering
Porosity
Elastic modulus
5
Papers
9
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Optimizing ULK film properties to enable BEOL integration with TDDB reliability
2015
IITC | International Interconnect Technology Conference
E. Todd Ryan
Deepika Priyadarshini
Stephen M. Gates
Hosadurga Shobha
James Chen
Kumar Virwani
Anita Madan
E. Adams
Elbert E. Huang
E. Liniger
D. Collins
M. Stolfi
Kang Sub Yim
Alex Demos
Alfred Grill
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Effects of e-beam curing on glass structureand mechanical properties of nanoporous organosilicate thin films
2010
International Journal of Materials Research
David M. Gage
Luming Peng
Jonathan F. Stebbins
Kang Sub Yim
Amir Al-Bayati
Alex Demos
Reinhold H. Dauskardt
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Structure et procédé pour interfaces sicoh présentant une résistance mécanique accrue
2008
Daniel C. Edelstein
Alexandros T. Demos
Stephen M. Gates
Alfred Grill
Steven E. Molis
Vu Ngoc Tran Nguyen
Steven Reiter
Darryl D. Restaino
Kang Sub Yim
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Development and optimization of porous pSiCOH interconnect dielectrics for 45 nm and beyond
2008
IITC | International Interconnect Technology Conference
Alfred Grill
Stephen M. Gates
Christos D. Dimitrakopoulos
Vishnubhai Vitthalbhai Patel
S. Cohen
Y. Ostrovski
E. Liniger
Eva E. Simonyi
Darryl D. Restaino
S. Sankaran
Steven Reiter
Alex Demos
Kang Sub Yim
Vu Ngoc Tran Nguyen
Juan Carlos Rocha
Dustin W. Ho
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Citations (5)
Procede de traitement de couche de constante dielectrique par faisceau electronique
2003
Farhad Moghadam
Jun Zhao
Timothy W. Weidman
Rick J. Roberts
Li Qun Xia
Alexandros T. Demos
Wen H. Zhu
Tzu-Fang Huang
Lihua Li
Ellie Yieh
Yi Zheng
Srinivas D. Nemani
Eric Hollar
Kang Sub Yim
Son Van Nguyen
Lester A. D'Cruz
Troy Kim
Dian Sugiarto
Peter Wai-Man Lee
Hichem MSaad
Melissa M. Tam
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