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L. Zhang
L. Zhang
IMEC
Materials science
Dielectric
Electronic engineering
Copper interconnect
Porosity
3
Papers
2
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0
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Toward successful integration of gap-filling ultralow-k dielectrics
2016
IITC | International Interconnect Technology Conference
L. Zhang
J.-F. de Marneffe
Alicja Lesniewska
P. Verdonck
Nancy Heylen
G. Murdoch
Kristof Croes
Zs. Tokei
Jürgen Bömmels
S. Lefferts
S. De Gendt
Mikhail R. Baklanov
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Optimized pore stuffing for enhanced compatibility with interconnect integration flow
2015
IITC | International Interconnect Technology Conference
J.-F. de Marneffe
L. Zhang
Vito Rutigliani
G. Noya
Y Cao
Alicja Lesniewska
Olalla Varela Pedreira
Kristof Croes
C. Gillot
Zsolt Tokei
J. Boemmels
Mikhail R. Baklanov
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Alternative integration of ultralow-k dielectrics by template replacement approach
2015
IITC | International Interconnect Technology Conference
L. Zhang
J.-F. de Marneffe
Nancy Heylen
G. Murdoch
Zsolt Tokei
J. Boemmels
S. De Gendt
Mikhail R. Baklanov
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