Ag-Cu-Ti/Sn nano-particle soldering paste and preparation method thereof

The invention discloses Ag-Cu-Ti/Sn nano-particle soldering paste and a preparation method thereof. The soldering paste is prepared from, by mass, 80-90% of nano-particle solid components and 10-20% of modifying agent, wherein the modifying agent comprises, by mass, 2-8 parts of dispersing agent, 2-8 parts of binding agent, 2-10 parts of diluent and 2-10 parts of soldering flux; the nano-particle solid components are formed by mixing Ag, Cu and Ti or Sn, the Cu accounts for 20-50% of the total mass of the nano-particle solid components, and the Ti or Sn accounts for 0-20% of the nano-particle solid components. The method comprises the following preparation steps: 1, weighing the nano-particle solid components; 2, adding the modifying agent sequentially; 3, evenly and uniformly mixing the system in an organic solvent, then evaporating the excessive solvent out, and forming the Ag-Cu-Ti/Sn nano-particle soldering paste; 4, placing the Ag-Cu-Ti/Sn nano-particle soldering paste obtained through preparation into a needle tube to be sealed and stored. The Ag-Cu-Ti/Sn nano-particle soldering paste has the advantages that the ratios of any components are controllable, the process is simple, and the cost is low.